Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design
Features:
- High speed, accurate solidification capacity ±10um@3σ;
- High production efficiency, low cost input
- High multi-chip processing capacity, support 16 different types of chip placement
- High flexibility to support multiple carrier operations
- Can work in different plane heights, support deep cavity work
- Modular platform design, small appearance, small footprint
Product advantage:
| High precision Accuracy: ±10μm@3σ Angle: ±0.15°@3σ High precision linear motor |  |
| Waffle pack / Gel-Pak Supports 16 Waffle packs (2 "x 2") 4”x 4”size is available. |  |
| Automatic height measurement Accuracy: 3μm Supports a variety of probes Can be replaced with laser altimeter according to demand |  |
| Nozzle station Quick automatic nozzle change Supports 7 nozzle stations. |  |
| Visual recognition 2448x2048 resolution 256 gray level Support gray value template, custom shape template The platform can be positioned twice. The Angle error is ±0.01deg. |  |
| Deep cavity operation Work at different plat heights. The maximum depth is 11mm. |  |
Features of dispensing function:
- Supports various types of epoxy adhesives
- Meet various graphic dispensing needs
- Comes with commonly used standard graphics library
- Support custom graphics library
Product parameters:
| Item | Specification |
| Placement accuracy | ≤±10um@3σ |
| Placement angle accuracy | ±0.15°@3σ |
| Force control range | 20~1000g(with different configurations, the maximum support is 7500g) |
| Force control accuracy | 20g-150g:± 2g@3σ 150g-1000g:±5%@3σ |
| Substrate pallet size(mm) | L200 X W90~150 |
| Tray size(mm) | Based on customer products |
| Loading/Unloading | Manual / auto |
| IC dimension(mm) | L0.25X W0.25—L10 X W10 |
| IC supply | Waffle tray |
| Core module movement mode | Linear motor + grating scale |
| Glue feeding mode | Dispensing + painting glue |
| Auto change nozzle | Seven |
| Bottom photo-taking | Equipped with camera |
| Machine dimension(mm) | L(1400)*W(1250)*H(1700) |
| Weight | Net weight of equipment:Approx.1500Kg |
Notices:
1.Leakage protection switch: ≥100ma
2.Compressed air requirement: 0.4-0.6Mpa
Inlet pipe specification: Ø10mm
3.Vacuum requirement:<-88kPa
Inlet pipe specification: Ø10mm
Tracheal joint: 2 pieces
4.Power requirements:
①Voltage: AC220V, frequency 50/60HZ
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA
5.The ground is required to withstand a pressure of 800kg/m².
Product Tags:
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High Speed Small Footprint IC Bonding Machine Modular Platform Die Bonder Machine Images
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